Method for fixing an electronic component and its contacts to a support

ABSTRACT

A method for positioning an electronic component and its contacts on a card is disclosed. The electronic component is first of all placed in the cavity of the card, then the electrical contacts are placed on the card and electrically connected to the output terminals by a so-called tape automatic bonding process using a film on which the electrical contacts are deposited.

.Iadd.This ia a continuation of application Ser. No. 07/912,867, filedJul. 13, 1992, abandoned. .Iaddend.

FIELD OF THE INVENTION

The invention concerns a method to position and fix an electroniccomponent and its contacts on a support, such as an identification oridentity card or a bank card, so that the electronic component is housedin the cavity and so that its contacts are fixed to the card.

DESCRIPTION OF THE PRIOR ART

Identification cards are used in many fields, especially in that of bankcards or credit cards. For a long time apart from an identificationnumber and the bearer's number, these cards had only a magneticrecording, enabling him to be identified by magnetic reading. For manyyears now, these cards have been used for other functions than foridentifying the bearer and, especially, for prepayment and protectionagainst fraudulent activities. To this end, the card has an activeelectronic component, which may consist of an electronic memory whichmay or may not be associated with a microprocessor, thus enabling itsuse notably for banking type applications.

Credit cards made with this technology, which have an electroniccomponent, are manufactured in various ways. According to a firstmethod, a cavity is made in the thickness of the card to house theelectronic component. According to another method, known as"colamination", thin layers of plastic material, such as an epoxymaterial, polyethylene, polyvinyl chloride etc. are laminated around thecomponent. During the implementation of these methods, various otheroperations are further performed to connect the terminals of theelectronic component, electrically, with metallizations placed on thesurface of the card.

One of the methods used to install the electronic component in thecavity made in the card and to place the metallizations on the card, aswell as to make the connections between the terminals of the card andthe metallizations consists, as shown in FIG. 1, in the use of anon-conductive film 1, made of an epoxy material for example. This filmhas, on one side, the electronic component in the form of a chip(reference 2) and, on the other side, metallized surfaces such as thosemarked 3, 4 and 5, separated from one another by spaces 6 and 7 withoutmetallization. These metallized surfaces 3, 4 and 5 communicate with theother side of the film 1 by means of holes 8, 9 and 10, through whichthe ends of the conducting wires 11, 12 and 13 get connected with thecorresponding metallized surfaces by any known means, such as aconductive bonder. The other end of each conducting wire is connected toan output terminal 14, 15 or 16 of the chip 2.

These operations are then followed by the coating of the chip 2 withresin, and the curing of the resin, by heat, to encapsulate the chip.The chip can then be installed in the cavity of the card and themetallizations can be placed at the edge of the cavity by simply fittingin the chip and bonding the support film 1 to the card after it has beencut out to the requisite dimensions.

According to a method of this type, the electrical contacts and the chipor electrical component are first positioned on the film. Then, theelectrical connection is made between the output terminals of the chipand the electrical contacts previously deposited on the film. Afterencapsulation, the set is installed on the card by bonding theencapsulated chip at the bottom of the cavity provided for this purpose,while the film is bonded to the edges of the cavity in such a way thatthe electrical contacts are accessible on the outside of the card.

This method has the drawback of necessitating a great many handlingoperations, notably to get the chip carried by the supporting film, thenconnected to the edges of the cavity, then encapsulated and finallypositioned in the cavity. Furthermore, the encapsulating operation isvery lengthy, for it is not possible to heat the resin beyond 150° C.,the film and the bonder of the contacts would not stand up to a highertemperature.

The purpose of the present invention, therefore, is to implement amethod which is designed to fix an electronic component and its contactsto a support such as an identity card, a method which does not have thedrawbacks of prior art methods.

SUMMARY OF THE INVENTION

The invention, therefore, relates to a method to fix an electroniccomponent and its contacts on a support, said support comprising acavity to house said component, said method comprising the followingoperations:

(a) the positioning of an electronic component in the cavity, so thatthe output terminals of the component are accessible through the openingof the cavity;

(b) the positioning of the electrical contacts on a supporting film,according to a pattern appropriate to the geometry of the outputterminals of the electronic component;

(c) the positioning of the electrical contacts on the support by meansof the supporting film;

(d) the simultaneous electrical connection of said electrical contactsto the output terminals of the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will appear fromthe following description of a particular embodiment, said descriptionbeing made with reference to the appended drawings, wherein:

FIG. 1 shows a perspective view of an electronic component and itsconnections arranged on a supporting film according to the prior art;

FIG. 2 is a perspective view showing the electronic component on thesupport before it is electrically connected, according to the invention,with the external electrical contacts;

FIG. 3 is a perspective view of another arrangement of the support ofthe contacts which can be used according to the method of the invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 1, which corresponds to a prior art method, has been described inthe introduction. According to this method, first of all, the setcomprising the electronic component and the electrical contacts isprepared on a separate support and then this set is assembled on thecard. The invention is based on an entirely different approach so as toavoid, firstly, the operation in which the chip is electricallyconnected to the electrical contacts of the supporting film and,secondly, the encapsulation operation once the chip is on the supportingfilm.

This new method consists, first of all, in fixing the encapsulated ornon-encapsulated chip in the cavity of the card so that its outputterminals are flush with the level of the opening of the cavity. Thisoperation is followed by a bonding of the contacts to the card and,simultaneously, by their electrical connection to the output terminalsof the chip.

FIG. 2 shows the card 20 comprising a cavity 21, the lower part of whichis closed by the bottom of the card, while the upper part is open toenable the installation of an electronic component in the form of a chip22. This chip 22 essentially consists of a silicon pad in which and onwhich a complex electronic circuit has been made in the form ofintegrated circuits. This complex electronic circuit has outputterminals 23 to 26 which have been arranged so that they appear on theopening side of the cavity. Usually, to protect the chip and the outputterminals, the set is coated with resin which lets the output terminalsgo beyond it. This resin is hardened by heating to a temperature ofabout 300° C. The chip 22 is housed in the cavity 21 and bonded to thebase by any known method enabling precise positioning with respect tothe card so that the output terminals 23 to 26 have precise positions inspace, with a precision, for example, in the range of one hundredmicrons. This is a purely mechanical operation which raises nodifficulties whatsoever in the present state of the art.

When the chip 22 is positioned in the cavity, the contacts arepositioned on the card 20 and electrically connected to the outputterminals 23 to 26. For this purpose, it is planned that contacts 27 to30 will be deposited on a film 31 in an appropriate pattern. Thecontacts 27 to 30 are then transferred from the film 31 to the card 20by bonding, pressing and heating. During this transfer operation, calledtape automatic bonding, the contacts 27 to 30 get soldered,respectively, to the output terminals 23 to 26. Furthermore, when thepressing stops and the card is separated from the film 31, this film getdetached from the contacts 27 to 30 which, for their part, remain bondedto the card 20.

As an alternative to the method, it is proposed (FIG. 3) to deposit onthe card 20, not only the contacts 27 to 30, but also a cut-out part ofthe film 31. According to this alternative, the contacts 27 to 30 aredeposited on the upper face on the film 31, and not on the lower face asshown in FIG. 2. To make it possible to set up the electrical connectionwith the output terminals 23 to 26, each contact 27 to 30 communicateswith the lower face of the film through a hole 32 to 35 which issuitably placed with respect to the position of the associated outputterminal. The film, or more precisely that part of the film whichcarries the contacts 27 to 30, is then bonded to the card 20 while theoutput terminals 23 to 30 are respectively soldered to the contacts 27to 30 by means of the corresponding holes 32 to 35.

The contacts 27 to 30 can have various shapes which vary according tothe geometry and arrangement of the output terminals 23 to 26 of thechip.

Moreover, the point of connection between the contact and the outputterminal may also have various shapes. It may be a connection betweentwo surfaces as is the case in FIG. 2, or a connection between a pointand a surface or, again, between two points, as is the case in FIG. 3.There may also be a wire-to-wire connection if the contacts 27 to 30 areextended by conductors of small width, with their ends soldered to theoutput terminal of the electronic component.

What is claimed is:
 1. A method to fix an electronic component and itsexternal contacts on a support, said support comprising a cavity tohouse said component, said method comprising the followingoperations:(a) positioning the electronic component (22) in the cavity(21), so that output terminals (23-26) of the component are accessiblethrough the opening of the cavity; (b) positioning the externalelectrical contacts (27-30) on a supporting film (31), according to apattern appropriate to the geometry of the output terminals of theelectronic component; (c) positioning the electrical contacts on thesupport (20) by means of the supporting film (31); (d) simultaneouslyelectrically connecting said electrical contacts (27-30) to the outputterminals (23-26) of the electronic component (22);wherein prior to thefirst positioning step (a), the electronic component is coated withresin which allows the output terminals (23-26) to extend through saidprotective resin coating whereby the surface of the component isprotected.
 2. A method according to claim 1, wherein said resin is aheat setable resin and is hardened by heating to a temperature of about300° C. .Iadd.
 3. A method of attaching an electronic component havingoutput terminals to a supporting structure having an upper surface and acavity opening upon the upper surface, comprising the steps of:coatingthe electronic component with resin, wherein the output terminals remainuncovered; positioning the electronic component in the cavity with theoutput terminals exposed in the cavity, and with the output terminalsapproximately coplanar with the upper surface; positioning externalelectrical contacts on a supporting film in a pattern corresponding tothe locations of the electronic component output terminals; positioningthe supporting film on the upper surface so that the external electricalcontacts contact the electronic component output terminals; andsimultaneously bonding the external contacts to the electronic componentoutput terminals. .Iaddend..Iadd.
 4. The method of claim 3, furthercomprising the step of, after said bonding step, removing the supportingfilm. .Iaddend..Iadd.
 5. The method of claim 3, wherein the externalcontacts are positioned on the supporting film on a side opposite a sideattached to the upper surface, and wherein electrical contact is madebetween the output terminals and the electrical contacts throughopenings in the supporting film, whereby the supporting film remains aspart of a composite structure with the supporting structure..Iaddend..Iadd.6. A method of connecting external electrical contactsfor a package with an electronic component carried internally thereof,comprising the steps of:positioning the electronic component in a cavityof a supporting structure so that output terminals of the electroniccomponent are exposed and approximately coplanar with an upper surfaceof the package; forming conductive leads on a surface of a supportingfilm; positioning the supporting film so that the external contacts makeelectrical contact with the output terminals; and bonding the externalcontacts to the output terminals to form external package contacts..Iaddend..Iadd.7. The method of claim 6, further comprising the step ofremoving the supporting film so as to leave the external contactsbehind. .Iaddend..Iadd.8. The method of claim 6, further comprising thestep of, before positioning the electronic component in the cavity,coating the electronic component with resin so as to leave the outputterminals exposed. .Iaddend..Iadd.9. The method of claim 6, wherein theexternal contacts are positioned on the supporting film on a sideopposite a side attached to the supporting structure, and whereinelectrical contact is made between the output terminals and theelectrical contacts through openings in the supporting film, whereby thesupporting film remains as part of a composite structure with thesupporting structure. .Iaddend.